MediaTek Releases New Dimensity 6300+ 5G Chipset with Small Performance Improvements
Technology giant MediaTek has recently unveiled its latest entry-level 5G chipset, the Dimensity 6300+. Priced at around INR 10,000 (approximately HK$940), the chipset is set to be shipped first to Realme. Built using the TSMC 6nm process, the Dimensity 6300+ is said to be an upgraded version of its predecessor, the Dimensity 6100+.
The Dimensity 6300+ processor features a 2+6 architecture, with a 2.4GHz clock Cortex-A76 dual-core and a 2.0GHz clock Cortex-A55 six-core configuration. The chipset also boasts a Mali-G57 MC2 GPU for improved graphics performance, about 10% better than the previous generation.
In terms of compatibility, the Dimensity 6300 chipset supports LPDDR4X RAM and UFS 2.2 storage, and is capable of handling screens up to 2,520 x 1,080 pixels. It also supports up to 108 million pixel primary lenses, dual-band Wi-Fi 5, and Bluetooth 5.3 wireless transmission. With a 5G modem offering download speeds of up to 3.3Gb/s and UltraSave 3.0+ 5G power-saving technology, the chipset promises impressive overall performance.
Overall, the Dimensity 6300+ 5G chipset from MediaTek is set to bring small yet significant performance improvements to entry-level smartphones, with enhanced graphics, connectivity, and power-saving features.